• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A device for thermal conditioning an electronic component mounted in a housing (150) positioned on a multilayer printed circuit (100), said device being characterized in that it comprises: • at least one active component (101) disposed on said circuit printed, and adapted to produce or absorb thermal energy, • at least one heat transfer surface (140) internal to said printed circuit located under said housing, • a device (131, 541, 542) for transferring thermal energy between said one or more active components (101) and said heat transfer surface (140), • at least one metal element (141) connecting said heat transfer surface (140) to said housing (150) on the multilayer printed circuit. Printed circuit comprising such a device for thermal conditioning of an electronic component, associated heating and cooling method.
    公开号:FR3034947A1
    申请号:FR1553178
    申请日:2015-04-13
    公开日:2016-10-14
    发明作者:Jean-Marc Armani；Jean-Lucien Mazeau
    申请人:Commissariat a lEnergie Atomique CEA；Commissariat a lEnergie Atomique et aux Energies Alternatives CEA；
    IPC主号:
    专利说明:

    [0001] The invention is in the field of ionizing radiation curing, and more particularly to a device allowing the regeneration, on a printed circuit, of a device which can be used to regenerate electromagnetic components subjected to radiation. electronic component subjected to ionizing radiation by annealing at high temperature. The electronic components CMOS (acronym for Complementary Metal Oxide Semiconductor) are sensitive to gamma ionizing radiation, and their electrical characteristics degrade after prolonged exposure. It is possible to regenerate irradiated CMOS components by the application of high temperature annealing. The application of the regeneration during the operation of the component can make it possible to significantly extend its lifetime in a radiative environment. Cooling the components that have been heated to be regenerated can allow a normal situation to be restored more quickly, thereby decreasing the duration of non-availability of the component. On the other hand, the cooling can also be useful in the case of analog circuits low noise small signals to improve their electrical performance. However, the variety of types of commercial components can make it difficult to systematically apply heating or cooling directly to the housing. By way of example, some photo or video sensors can be exemplified in through-pin boxes or in BGA (Bali Matrix Ball) boxes, for which the top of the box is unusable. The problem also arises for components of small dimensions (lower than those of the heating resistance). The disclosed invention provides a solution for these situations by transferring heat or cold to a component box using layers of the printed circuit board on which it is mounted. 3034947 2 It is known to those skilled in the art solutions for heating the entire printed circuit, to regulate its temperature to allow operation in environmental conditions outside the intended ranges of use by heating it in area. However, these solutions do not make it possible to wear one of the components of the circuit at very high temperatures. One of these solutions is described, for example, in US patent application 6,262,392 B1. Figure 1 describes a case where the printed circuit has a top layer for heating all components of the circuit. In this solution, the thermal energy delivered by resistors is distributed over the entire upper layer. This solution poses the problem of the dissipation of the delivered energy, which may be a problem in achieving the high temperatures required for annealing regeneration of a component. Finally, such a device heats all the components of the printed circuit, which can degrade components that are not intended to be regenerated by the high temperature annealing process. Figure 2 of the same application shows a solution in which the heating layer is located inside the printed circuit. This solution poses, in addition to the problems of FIG. 1, the problem of the low thermal conductivity between the inner layer of the printed circuit and the components positioned on the surface. It is also known to those skilled in the art of heating solutions located on a component, as in US Pat. No. 8,445,818 B2. This patent shows in Figure 2 a solution for heating an electronic component on a printed circuit, wherein a component 30 for producing heat is positioned on the electronic component to be heated. However, this solution does not provide a response to cases where the top of the housing of the electronic component is not accessible, or in cases where the housing is smaller than the heating component. The same patent shows in Figure 3 a heating solution in which the printed circuit comprises a heating top layer on which the electronic components are placed. This solution is not suitable because the upper layer covers the entire printed circuit, and requires the use of heating components positioned inside the heating layer. The invention therefore proposes to solve the problem of high temperature carrying of a component on a printed circuit, in particular for performing the annealing of a CMOS component subjected to ionizing radiation and its subsequent cooling, by proposing a device using heating resistors or cold elements mounted on the surface of the printed circuit, and connected to an internal thermal transfer surface to the printed circuit, arranged under the component, to which it is connected by one or more metallic elements, the elements metal can be the legs of the housing or holes in the printed circuit 15 filled with metal links, called vias. The size of the heat transfer surface is adapted to the size of the component, so as to ensure optimal use of the heat produced by the resistors, and thus achieve the very high temperatures required for the annealing, these temperatures The invention is also applicable to active components intended to produce cold, thus allowing an accelerated return to a nominal operating temperature. Thus, the invention proposes a device for thermal conditioning of an electronic component mounted in a housing positioned on a multilayer printed circuit. The device according to the invention is characterized in that it comprises: at least one active component disposed on said printed circuit, and adapted to produce or absorb thermal energy, at least one internal heat transfer surface to said printed circuit located under said housing, - at least one device for transferring thermal energy from said active component (s) to said heat transfer surface, - at least one metallic element connecting said heat transfer surface to said housing located on the multilayer printed circuit board. According to one embodiment, it further comprises a collector track 5 thermally connected to said active component (s). Advantageously, the collector track is in contact with the housing of the electronic component. In another embodiment of the device according to the invention, the heat transfer surface is connected to the collector track, from which it is electrically isolated by power diodes. In another embodiment of the device according to the invention when it comprises a collector track, the thermal energy transfer device comprises at least one metallic element connecting the collector track to the internal thermal transfer surface of the printed circuit. . In another embodiment, when the one or more active components for producing thermal energy are through-legged components, the transfer of heat energy produced is made by at least one of the legs of the active component (s). . Advantageously, in all of the embodiments of the device according to the invention, the internal thermal transfer surface of the multilayer printed circuit 25 is positioned in the inner layer of the printed circuit closest to the electronic component. In another embodiment of the device according to the invention, the thermal energy transfer device comprises a plurality of conductive surfaces internal to the printed circuit, positioned on either side of a portion of said transfer surface. non-contacting thermal contact therewith, said conductive surfaces (541, 542) being connected to said at least one active component (101) by at least one metallic element. The device is advantageously applied when the electronic component is a CMOS component that can be regenerated by high temperature annealing. Advantageously, the active component (s) are chosen from heating resistances and thermoelectric elements. In one embodiment of the device according to the invention, the heat transfer surface is connected to an electric potential of the printed circuit. In another embodiment of the device according to the invention, it further comprises a temperature control module of the electronic component, configured to control the active elements. The invention also addresses a multilayer printed circuit comprising a device as described above. Finally, the invention addresses a method of thermal conditioning of an electronic component positioned in a housing located on a multilayer printed circuit, said printed circuit comprising a device as described above. The method is characterized in that it comprises a step of temporarily activating at least one active component intended to produce heat. The method may also include a subsequent step of temporarily activating at least one active component for producing cold. The invention will be better understood and other features and advantages will become apparent on reading the description which follows, given in a non-limiting manner, and with reference to the appended figures in which: FIGS. 1a and 1b show a view from above and A sectional view of the device according to one embodiment of the invention, FIG. 2 shows a top view of the device according to a second embodiment of the invention, in which the active elements are moved away from the device. the location of the electronic component; FIGS. 3a and 3b show a top view and a sectional view of the device according to a third embodiment of the invention, in which the collector track is connected to the electronic component, FIG. 4 shows a circuit diagram for electrically isolating the heat transfer surface of the collector track, - Figure 5 shows another embodiment for electrically isolating the heat transfer surface of the collector track.
    [0002] Figures la and lb show a top view and a sectional view of the device according to a first embodiment of the invention. In this embodiment, active elements 101 are positioned on the surface of a printed circuit 100. These active elements are electrically and thermally connected on the one hand to a first track 120, having a first electrical potential, and on the other hand a second track 130, called collector track, having a second electrical potential. The first electrical potential may for example be a supply voltage, and the second electrical potential a mass. All potential configurations are possible since the potentials are adapted to the active components and are compatible with the component to be regenerated. The active components are adapted to produce or absorb thermal energy. They may for example be heating resistors, in order to produce heat, or Peltier thermoelectric elements, in order to produce cold. These components can indifferently be through-leg components, or CMS components (acronym for Surface-Mounted Component). The rest of the document will speak of the production of thermal energy, therefore of heat, but applies in the same way to the absorption of thermal energy, and therefore the production of cold.
    [0003] The multilayer printed circuit comprises a heat transfer surface 140 internal to the printed circuit substrate. This heat transfer surface 140 covers an area under the housing location of the electronic component targeted by the annealing process. Its shape is adapted to cover an area corresponding to the location of the housing of the electronic component and a portion of the collector track, while being as small as possible. For greater efficiency, there must be around this surface a large area without metal conductors, in order to keep the heat as locally as possible. This heat transfer surface 140 is connected to the active elements 101 by a device for transferring thermal energy. In FIG. 1, this transfer device is in the form of the collector track 130, associated with metal elements 131 connecting it to the heat transfer surface 140. In other embodiments described below, this The device may be embodied by the tabs of the active components, an interleaving of layers internal to the substrate, combinations of these different embodiments, or any other implementation for conveying thermal energy between the active components 101 and the surface. heat transfer 140, by conduction and / or radiation. The heat transfer surface 140 is also connected to the housing of the electronic component 150 towards which the thermal energy must be transferred by metal elements 141.
    [0004] Thus, the active components 101 produce thermal energy, which is transmitted to the collector track 130 to which they are connected. The collector track 130 transmits this energy to the heat transfer surface 140 internal to the printed circuit by conduction through metal elements 131. Typically, these metal elements are vias made in the printed circuit so as to connect the collector track 130 to the thermal transfer surface 140. The thermal energy produced then propagates in the heat transfer surface 140, to be transmitted to the electronic component 150 by: radiation of the heat transfer surface 140 located beneath the component, or radiation absorption of the electronic component in the case of the production of cold, and 5 - conduction through the metal elements 141. Advantageously, when the housing 150 of the electronic component is a box with through legs, the legs 143 having the same electrical potential that the heat transfer surface 140, internal to the substrate of the circuit im awarded, can be connected to the heat transfer surface. This is the case in Figure 1b in section, where the metal elements 141 connecting the heat transfer surface to the housing of the electronic component are vias 142 and tabs 143 of the housing of the electronic component.
    [0005] Thus, in a variant of an embodiment of the invention, the collector track 130 and the heat transfer surface 140 are connected to the ground of the printed circuit, the grounding lugs of the electronic component being then connected to the ground. heat transfer surface.
    [0006] Similarly, when the active components are through-leg components, they can be connected directly to the heat transfer surface 140, the collector track 130 then no longer being required for the operation of the device.
    [0007] The device of the invention makes it possible to use active elements 101 of limited size for the thermal conditioning of an electronic component by heating or cooling. These components not being in direct contact with the housing 150 of the electronic component, their relative size does not affect the feasibility of the solution.
    [0008] These active elements are mounted on the printed circuit substrate by conventional manufacturing techniques, although specific to the field of high temperature. The heat generated is concentrated on a very limited surface of the printed circuit, thus avoiding too much loss. This heat is transmitted to the component to be heated, by radiation and conduction, using the internal layers of the PCB and electrical connections via vias or the legs of the components. The invention is not limited to the annealing of a single component, but can be adapted for the annealing of several electronic components. For this, the heat transfer surface will have to be disposed under all these components. In another embodiment, the printed circuit may include several heat transfer surfaces, each of which is connected to the same collector track. In order that the energy transmitted by radiation from the heat transfer surface to the electronic component is as large as possible, the inner layer of the printed circuit used for the heat transfer surface 140 is preferably the layer closest to the component. Ideally, the substrate used to make the printed circuit minimizes the infra-red radiation. The widths of the tracks 120 and 130 are adapted so as to best transmit the thermal energy in the areas of interest. Thus, the track 120, which is not intended to transmit thermal energy, may be as thin as possible, so as to minimize heat conduction to the other elements of the printed circuit. A track width of less than 1 mm, for example 0.6 to 0.8 mm, is a good compromise between the ohmic voltage drop and the thermal conduction. Similarly, the collector track 130 is wide in the energy collection and exchange zone towards the heat transfer surface 140, so as to promote thermal conduction, and thinner in the zone electrically connecting this track to a thermal potential, in order to minimize thermal conduction in this zone. The density of the metal elements 131 and 141 respectively connecting the collector track 130 to the heat transfer surface 140, and the heat transfer surface 140 to the electronic component 150, also impacts the quality of the heat exchange, a high density of metal elements. promoting thermal conduction.
    [0009] The invention therefore makes it possible to convey heat or cold to an electronic component, regardless of the format of its case, by using standard active components and a standard method of producing the printed circuit. The efficiency of the heating or cooling 5 is favored by the use of a limited exchange area, which allows the use of active components of reduced size. This solution is robust, due to the possible redundancy of the active elements around the electronic component, and the use of surface mounted components, which can be easily replaced when they are damaged. The temperatures targeted by the annealing being very high (generally greater than a hundred degrees Celsius), the device can be associated with a power generation equipment for supplying the heating elements of the printed circuit. The device may also be associated with a temperature probe bonded to the component, or a nearby zone, and to a temperature control system, positioned on the printed circuit, or outside, depending on the requirements due to the exposure to radiation. The control system is configured to activate or deactivate the active elements 101 during the annealing of the electronic component.
    [0010] Ideally, the active components are positioned near the electronic component to be heated to reduce the size of the heat transfer surface and the length of the collector track. However, it is possible to deport the production of heat or cold in dedicated areas of the printed circuit, the shape of the collector track and the heat transfer surface being adapted to promote heat exchange. This is the case shown in FIG. 2, where the active components 201 are deported, the heat transfer surface 240 then being adapted to cover the location of the housing 150 of the electronic component and a part 30 of the collector track 230. 3 illustrates a third embodiment, in which the collector track 330 differs from the collector track 130 of FIG. 1 in that it is further adapted to be in thermal contact with the housing of the electronic component 150. Heat exchanges between the collector track and the component can be promoted by the use of thermal paste 332. Advantageously, in order to promote the radiation of the heat transfer surface on the electronic component, a metal reflector plane 360 is positioned under this heat transfer surface. The thermal energy radiated by the heat transfer surface 140 towards the reflector plane 360 is then returned to the heat transfer surface and the electronic component 150, thus reducing energy losses.
    [0011] Figure 4 shows an electrical schematic for electrically isolating the heat transfer surface of the collector track. In the case where the electronic component is sensitive to current variations, it may be advantageous to electrically isolate the heat transfer surface from the collector track. For this purpose, power silicon diodes 401 and 402 are disposed bead head between the collector track 130 and the heat transfer surface 140. FIG. 5 shows another embodiment for electrically insulating the heat transfer surface. In this embodiment, the device for transferring the thermal energy between the active components 101 and the heat transfer surface 140 is materialized by interleaving layers internal to the printed circuit substrate, thus enabling the energy to be transferred by radiation. thermal 25 to the heat transfer surface without making electrical contact between this surface and the collector track. For this, the heat transfer surface 140, internal to the substrate of the printed circuit, is positioned between at least two conductive surfaces 541 and 542, these conductive surfaces being located in layers inside the substrate of the printed circuit, the closest possible to the heat transfer surface, but without being in contact therewith. These conductive surfaces are connected to the collector track 130 or directly to the active components 101, by metal elements such as vias or the legs of the components. An area 543, common to the heat transfer surface 140 and to the conductive surfaces 541 and 542 located on either side of this heat transfer surface, allows the transfer of heat energy by radiation without electrically contacting the heat transfer surface. heat transfer surface 140 with the heating elements 101 of the device. According to the same principle, it is possible to use more than two conductive surfaces to increase the radiated energy. The invention also addresses a method using the device described above for transferring heat to an electronic component for the purpose of annealing, the method of supplying active elements for producing heat for a limited time. , or up to a target temperature. The method may also be followed by a step of supplying active elements for producing cold for a limited time, or until the temperature of the component is reduced to a predefined range.
    权利要求:
    Claims (15)
    [0001]
    REVENDICATIONS1. A device for thermal conditioning of an electronic component mounted in a housing (150) positioned on a multilayer printed circuit board (100), said device being characterized in that it comprises: - at least one active component (101) disposed on said printed circuit, and adapted to produce or absorb thermal energy, - at least one heat transfer surface (140) internal to said printed circuit located under said housing, - a device (131, 541, 542) for transferring energy thermal between said one or more active components (101) and said heat transfer surface (140), - at least one metal element (141) connecting said heat transfer surface (140) to said housing (150) on the printed circuit board multilayers.
    [0002]
    2. A device for thermal conditioning an electronic component according to claim 1, further comprising a collector track (130) thermally connected to said active component (s) (101). 20
    [0003]
    The thermal conditioning device of an electronic component according to claim 2, wherein said collector track (330) is in contact (332) with the housing (150) of the electronic component. 25
    [0004]
    4. Device for thermal conditioning of an electronic component according to one of claims 2 and 3, wherein said heat transfer surface (140) is connected to said collector track (130) from which it is electrically isolated by power diodes (401, 402). 30
    [0005]
    5. A device for thermal conditioning an electronic component according to one of claims 2 to 4, wherein said thermal energy transfer device comprises at least one metal element (131) connecting said collector track (130) to said heat transfer surface (140) internal to the printed circuit. 35 3034947 14
    [0006]
    6. Device for thermal conditioning an electronic component according to one of the preceding claims, wherein the active component (s) (101) are through-legged components, and wherein said thermal energy transfer device comprises at least one of the legs of the active component (101).
    [0007]
    7. A device for thermal conditioning an electronic component according to one of the preceding claims, wherein said heat transfer surface (140) internal multilayer printed circuit is positioned in the inner layer closest to the electronic component.
    [0008]
    8. A device for thermal conditioning an electronic component according to one of claims 1 to 3, wherein said device for transferring the thermal energy comprises a plurality of conductive surfaces (541, 542) internal to said printed circuit, positioned on either side of a portion (543) of said thermal transfer surface (140) without contact therewith, said conductive surfaces (541, 542) being connected to said at least one active component (101) by at least one a metallic element. 20
    [0009]
    9. A device for thermal conditioning an electronic component according to one of the preceding claims, wherein said electronic component is a CMOS component that can be regenerated by annealing at high temperature.
    [0010]
    10. Device for thermal conditioning of an electronic component according to one of the preceding claims, wherein the active component (s) (101) are selected from heating resistors and thermoelectric elements.
    [0011]
    11. A device for thermal conditioning an electronic component according to one of the preceding claims, wherein said heat transfer surface (140) is connected to an electrical potential of the printed circuit. 25 3034947 15
    [0012]
    12. An electronic component thermal conditioning device according to one of the preceding claims, further comprising a temperature control module of the electronic component configured to control the active elements (101).
    [0013]
    13. A multilayer printed circuit comprising a device for thermal conditioning an electronic component according to one of claims 1 to 11.
    [0014]
    14. A method of thermal conditioning of an electronic component positioned in a housing (150) located on a multilayer printed circuit (100), said printed circuit comprising a device according to one of claims 1 to 11, characterized in that comprises a step of temporarily activating at least one active component intended to produce heat.
    [0015]
    15. The method of thermal conditioning an electronic component according to claim 13, further comprising a step subsequent to the step of temporarily activating at least one active component intended to produce heat, for temporary activation of at least one active component for producing cold.
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    EP3284316A1|2018-02-21|
    FR3034947B1|2017-04-21|
    WO2016166043A1|2016-10-20|
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    法律状态:
    2016-04-28| PLFP| Fee payment|Year of fee payment: 2 |
    2016-10-14| PLSC| Publication of the preliminary search report|Effective date: 20161014 |
    2017-04-28| PLFP| Fee payment|Year of fee payment: 3 |
    2018-04-26| PLFP| Fee payment|Year of fee payment: 4 |
    2019-04-29| PLFP| Fee payment|Year of fee payment: 5 |
    2020-04-30| PLFP| Fee payment|Year of fee payment: 6 |
    2021-04-29| PLFP| Fee payment|Year of fee payment: 7 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1553178A|FR3034947B1|2015-04-13|2015-04-13|PRIMED CIRCUIT HEATING AND COOLING DEVICE FOR REGENERATING ELECTRONIC COMPONENTS SUBJECT TO RADIATION|FR1553178A| FR3034947B1|2015-04-13|2015-04-13|PRIMED CIRCUIT HEATING AND COOLING DEVICE FOR REGENERATING ELECTRONIC COMPONENTS SUBJECT TO RADIATION|
    US15/566,197| US10791619B2|2015-04-13|2016-04-11|Device for heating and cooling by a printed circuit for regenerating electronic components subjected to radiation|
    EP16719235.0A| EP3284316B1|2015-04-13|2016-04-11|Device for heating and cooling by a printed circuit for regenerating electronic components subjected to radiation|
    PCT/EP2016/057878| WO2016166043A1|2015-04-13|2016-04-11|Device for heating and cooling by a printed circuit for regenerating electronic components subjected to radiation|
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